solder bump,goosebump

solder bump
electroplating solder bumping flip chip technology 电镀焊球凸点
5 medical devices 5 金凸块(gold bumping)设计 bumping design
electroplating solder bumping flip chip technology 电镀焊球凸点
芯片级封装有助于便携式医疗设备减小尺寸并减轻重量